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The effects of argon gas flow rate and furnace pressure on oxygen concentration in Czochralski silicon single crystals grown in a transverse magnetic field
Authors:Norihisa Machida  Keigo Hoshikawa  Yasuo Shimizu
Institution:

a R&D Center, Technology Division, Mitsubishi Materials Silicon Corporation, 1-297 Kitabukuro-cho, Omiya, Saitama 330-0835, Japan

b Faculty of Education, Shinshu University, Nishinagano, Nagano 380-0871, Japan

c Faculty of Engineering, Shinshu University, Wakasato, Nagano 380-0922, Japan

Abstract:The effects of the argon gas flow rate and furnace pressure on the oxygen concentration in a transverse magnetic field applied Czochralski (TMCZ) silicon single crystals were examined through experimental crystal growth. A gas controller which had been proposed by Zulehner was used for this series of experiments. In the TMCZ gas-controlled crystals, a decrease in the oxygen concentration with a decrease in furnace pressure was found. A clear relationship between the oxygen concentration and the argon gas flow rate was not obtained due to the limited experimental conditions. The relationships between the oxygen concentration and the furnace pressure and the argon gas flow rate previously observed for Czochralski (CZ) crystals by a similar gas controller were confirmed by the present gas controller. The oxygen concentration changes in the TMCZ and the CZ crystals were analyzed in terms of the calculated flow velocity of the argon gas between the gas controller and the silicon melt surface. In contrast with the CZ gas-controlled crystals, the oxygen concentration was decreased with an increase in the flow velocity of argon gas in the TMCZ gas-controlled crystals. The surface temperature model and the melt flow pattern model which had been proposed in the previous report are discussed again in light of the present experimental results.
Keywords:Silicon  Czochralsiki  Convection  Argon gas flow  Shear stress  Boundary layer  Oxygen concentration  Magnetic field  Transverse
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