Hamilton体系下含弱粘接复合材料层合板的灵敏度分析研究

基于径向基点插值函数(RPIM)，在Hamilton体系下研究了含弱粘接复合材料层合板的灵敏度分析问题．利用弹簧层模型和修正H-R(Hellinger-Reissner)变分原理，推导了可用于含弱粘接复合材料层合板响应和灵敏度分析的混合控制方程，给出了基于该混合控制方程进行灵敏度分析的解析法(AM)、半解析法(SA)和有限差分法(FD)．该混合控制方程的主要优点是可以在进行灵敏度分析过程中避免卷积运算．另外，利用该混合控制方程进行灵敏度分析不仅能够同时得到响应结果和灵敏度系数，而且还考虑了层合板的层间弱粘接问题．

Sensitivity Analysis of Composite Laminated Plates With Bonding Imperfection in Hamilton System

The sensitivity analysis of composite laminated plates with bonding interfacial imperfection was investigated based on the radial point interpolation method (RPMI) in Hamilton system.A hybrid governing equations of the response and sensitivity quantities was reduced by the spring-layer model and modified Hellinger-Reissner (H-R) variational principle.The analy ticalmethod (AM),semi-analy ticalmethod (SA) and the finite difference method (FD) were given for the sensitivity analysis approach which is based on this reduced hybrid governing-equation.One of the main advantages of the hybrid governing equation is that the convoluted algorithm is avoided in sensitivity analysis.In addition,the sensitivity analysis method using this hybrid governing equation not only obtains the response values and the sensitivity coefficients smiultaneity,butalso accounts for the bonding interfacial imperfections of composite laminated plates.