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Surface modification of Cu metal particles by the chemical reaction between the surface oxide layer and a halogen surfactant
Authors:Shun Yokoyama  Hideyuki Takahashi  Takashi Itoh  Kenichi Motomiya  Kazuyuki Tohji
Affiliation:1. Graduated school of Environmental Studies, Tohoku University, 6-6-20, Aramaki, Aobaku, Sendai 980-8579, Japan;2. Center for Interdisciplinary Research, Tohoku University, Aramaki aza Aoba 6-3, Aobaku, Sendai 980-8578, Japan
Abstract:Surface oxides on small (2–5 μm) copper metal particles can be removed by chemical reaction with tris(2,3-dibromopropyl) isocyanurate (TIC) in diethylene glycol mono-n-hexyl ether (DGHE) solution under mild conditions where metal particles are not damaged. Surface oxides convert to copper bromide species and subsequently dissolve into the solvent. It was found that resultant surface species are resistant to re-oxidation due to remaining surface bromides. This finding opens up a possibility to create microclines based on cheap copper nanoparticles.
Keywords:A. Oxide   A. Surfaces   C. Photoelectron spectroscopy   D. Surface properties
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