Embedded fine-grid method applied to three-dimensional stress-intensity-factor analysis

The purpose of this paper is to extend the embedded fine-grid method to three-dimensional stress-intensity-factor analysis. The embedded crossed fine grids give two components of displacement and are capable of calculatingK _I without the assumption of the plane-strain condition along a crack or a notch front. It is not valid to assume the plane-strain condition to calculateK _I in the vicinity of a free surface, whereK _I is influenced by a free surface (plane-stress condition). In this paper, a dyeing and bleaching process is considered to reproduce the crossed fine grids on an epoxy plate. By using these grids as embedded grids, the distributions ofK _I along notch fronts in SEN specimens with various different thicknesses and side grooves are studied. The influences of a free surface and the side-groove effects on the distribution ofK _I are discussed. Paper was presented at 1982 SESA/JSME Spring Meeting held in Oahu and Maui, HI on May 24–29.