Embedded fine-grid method applied to three-dimensional stress-intensity-factor analysis |
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Authors: | M Obata H Shimada |
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Institution: | (1) Department of Metal Processing and Mechanical Metallurgy, Faculty of Engineering, Tohoku University, 980 Sendai, Japan |
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Abstract: | The purpose of this paper is to extend the embedded fine-grid method to three-dimensional stress-intensity-factor analysis.
The embedded crossed fine grids give two components of displacement and are capable of calculatingK
I
without the assumption of the plane-strain condition along a crack or a notch front. It is not valid to assume the plane-strain
condition to calculateK
I
in the vicinity of a free surface, whereK
I
is influenced by a free surface (plane-stress condition).
In this paper, a dyeing and bleaching process is considered to reproduce the crossed fine grids on an epoxy plate. By using
these grids as embedded grids, the distributions ofK
I
along notch fronts in SEN specimens with various different thicknesses and side grooves are studied. The influences of a
free surface and the side-groove effects on the distribution ofK
I
are discussed.
Paper was presented at 1982 SESA/JSME Spring Meeting held in Oahu and Maui, HI on May 24–29. |
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Keywords: | |
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