Fluorine-plasma treated AlGaN/GaN high electronic mobility transistors under off-state overdrive stress

Influences of off-state overdrive stress on the fluorine-plasma treated AlGaN/GaN high-electronic mobility transistors (HEMTs) are experimentally investigated. It is observed that the reverse leakage current between the gate and source decreases after the off-state stress, whereas the current between the gate and drain increases. By analyzing those changes of the reverse currents based on the Frenkel-Poole model, we realize that the ionization of fluorine ions occurs during the off-state stress. Furthermore, threshold voltage degradation is also observed after the off-state stress, but the degradations of AlGaN/GaN HEMTs treated with different F-plasma RF powers are different. By comparing the differences between those devices, we find that the F-ions incorporated in the GaN buffer layer play an important role in averting degradation. Lastly, suggestions to obtain a more stable fluorine-plasma treated AlGaN/GaN HEMT are put forwarded.