| 倒装片的无铅焊接 |
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| 引用本文： | 盛水源.倒装片的无铅焊接[J].印制电路信息,2007(2):67-69. |
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| 作者姓名： | 盛水源 |
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| 作者单位： | 信息产业部电子科技情报所,北京,100040 |
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| 摘 要： | 文章通过试验证明:纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。锡和钴金属互化物具有比目前铜-UBM替代物更好的特性。
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| 关 键 词： | 倒装片 无铅焊接 寿命 |
| 文章编号： | 1009-0096(2007)02-0067-03 |
Lead-free Soldering of the Flip-Chip |
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| Sheng Shuiyuan.Lead-free Soldering of the Flip-Chip[J].Printed Circuit Information,2007(2):67-69. |
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| Authors: | Sheng Shuiyuan |
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| Institution: | Sheng Shuiyuan |
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| Abstract: | In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.The intermetallic compound between tin and cobalt have better property than the hitherto alternative with cupfer-UBM. |
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| Keywords: | flip-chip leadless soldering life |
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