| 红外焦平面可靠性封装技术 |
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| 引用本文： | 龚海梅,张亚妮,朱三根,王小坤,刘大福,董德平,游达,李向阳,王平,朱龙源,方家熊.红外焦平面可靠性封装技术[J].红外与毫米波学报,2009,28(2):85-89. |
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| 作者姓名： | 龚海梅 张亚妮 朱三根 王小坤 刘大福 董德平 游达 李向阳 王平 朱龙源 方家熊 |
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| 作者单位： | 中国科学院上海技术物理研究所传感技术国家重点实验室,上海,200083 |
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| 基金项目： | 国家自然科学基金重点项目，中国科学院知识创新工程项目 |
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| 摘 要： | 系统研究了红外焦平面组装、封装及其可靠性技术,解决了组件结构模拟、子模块精确定位、扁平引线设计、低漏率激光焊接、杜瓦内表面气体解吸分析及其解决途径等理论与技术问题,进行了组件可靠性、器件的高能粒子辐照与激光辐照等试验,获得了一批实用化焦平面组件杜瓦和扁平引线,并均已转入工程研制.研究结果表明微型杜瓦的热负载小于250mW,真空保持寿命大于1年半.
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| 关 键 词： | 红外焦平面 封装 可靠性 |
| 收稿时间： | 2008/4/15 |
STUDY OF RELIABLE PACKAGING FOR IRFPA DETECTOR |
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| GONG Hai-Mei,ZHANG Ya-Ni,ZHU San-Gen,WANG Xiao-Kun,LIU Da-Fu,DONG De-Ping,YOU D,LI Xiang-Yang,WANG Ping,ZHU Long-Yuan,FANG Jia-Xiong.STUDY OF RELIABLE PACKAGING FOR IRFPA DETECTOR[J].Journal of Infrared and Millimeter Waves,2009,28(2):85-89. |
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| Authors: | GONG Hai-Mei ZHANG Ya-Ni ZHU San-Gen WANG Xiao-Kun LIU Da-Fu DONG De-Ping YOU D LI Xiang-Yang WANG Ping ZHU Long-Yuan FANG Jia-Xiong |
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| Institution: | State Key Laboratory of Transducer Technology;Shanghai Institute of Technical Physics;Chinese Academy of Sciences;Shanghai 200083;China |
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| Abstract: | Techniques of assembly,packaging and reliability of infrared focal plane array(IRFPA) were systematically studied.Some theoretic and technical problems were solved,such as the simulation of assembly conformation,high precision allocation of the modules,the design of flat leading wire,low leakage rate of laser welding,the way to decrease outgassing of Dewar inner surface.For the IRFPA detector the tests of assembly reliability,high-energy particle and laser irradiations were carried out.A batch of practical ... |
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| Keywords: | IRFPA packaging reliability |
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