| 光学玻璃加工破坏层研究及粗磨、精磨、抛光工序加工余量的合理匹配 |
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| 引用本文： | 邬烈恭.光学玻璃加工破坏层研究及粗磨、精磨、抛光工序加工余量的合理匹配[J].光学技术,1996(2). |
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| 作者姓名： | 邬烈恭 |
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| 作者单位： | 康达光学制品厂 |
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| 摘 要： | 本文通过用五种散粒磨料（碳化硅）、五种固着磨料（金刚石）对八大类常用光学玻璃进行加工，用扫瞄电子显微镜观察其表面形貌，用抛测法测出其破坏层深度，得出一系列破坏层的深度数值，从而找出破坏层与磨料之问的函数关系。以破坏层的绝对深度为依据，得出光学加工中精磨、抛光工序的加工余量的合理匹配值。
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| 关 键 词： | 破坏层，精磨，抛光，加工余量。 |
Research of destruction layer of ground optical glass and founding process redundancy of fine-grinding and polishing |
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| Wu Liegong.Research of destruction layer of ground optical glass and founding process redundancy of fine-grinding and polishing[J].Optical Technique,1996(2). |
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| Authors: | Wu Liegong |
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| Abstract: | Grinding 8 kinds of optical glass by five abrasives and five grits bond diamond, by meansof electric scanning microscope looking at the surface of ground glass measuring depth of destructionlayer by polishing method, a serial of depth of destruction layer are given. The functional relation of destruction layer and abrasive is found out. According to destruction layer maximum depth reasonableprocess redundancy of fine-grinding and polishing in optical production has been given. |
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| Keywords: | destruction layer fine-grinding polishing process redundancy |
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