Analysis of a bi-piezoelectric ceramic layer with an interfacial crack subjected to anti-plane shear and in-plane electric loading |
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Authors: | Ai Kah Soh Dai-Ning Fang Kwok Lun Lee |
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Affiliation: | a Department of Mechanical Engineering, The University of Hong Kong, Hong Kong, China;b Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China |
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Abstract: | The behaviour of a bi-piezoelectric ceramic layer with a centre interfacial crack subjected to anti-plane shear and in-plane electric loading has been studied. The dislocation density functions and the Fourier integral transform method have been employed to eliminate the problem of singular integral equations. The normalized energy release rate, stress and electrical displacement intensity factors, G/G0,KIII/KIII0 and KD/KD0, respectively, were determined for different geometric and property parameters by use of two different crack surface electric boundary conditions, i.e. impermeable and permeable. It has been shown that the effects of the thickness and material constants of the piezoelectric layer on all the three parameters, i.e. G/G0,KIII/KIII0 and KD/KD0 were significant. |
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Keywords: | bi-piezoelectric ceramic interfacial crack Fourier integral transform energy release rate stress intensity factors electrical displacement intensity factor |
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