| 陶瓷表面无敏化活化法微细化学镀铜 |
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| 引用本文： | 续振林,郭琦龙,沈艺程,赵雄超,洪艳萍,辜志俊.陶瓷表面无敏化活化法微细化学镀铜[J].电化学,2005,11(2):193-198. |
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| 作者姓名： | 续振林 郭琦龙 沈艺程 赵雄超 洪艳萍 辜志俊 |
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| 作者单位： | 中科院福建物质结构研究所二部,中科院福建物质结构研究所二部,中科院福建物质结构研究所二部,中科院福建物质结构研究所二部,中科院福建物质结构研究所二部,中科院福建物质结构研究所二部 福建厦门361012中国科学院研究生院,北京100039
,福建厦门361012
,福建厦门361012中国科学院研究生院,北京100039
,福建厦门361012
,福建厦门361012
,福建厦门361012 |
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| 基金项目： | 福建省厦门市科技创新基金 |
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| 摘 要： | 本文提出一种新的化学镀铜工艺,与激光微细刻蚀技术相结合可在Al2O3基底上实现无敏化活化化学镀铜,获得光亮致密、分辨率较高(40μm),导电性良好的化学镀层.
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| 关 键 词： | 陶瓷基底 化学镀铜 活化 络合剂 金属化 互连导线 |
| 文章编号： | 1006-3471(2005)02-0193-06 |
| 收稿时间： | 2005-05-28 |
| 修稿时间： | 2004年12月17 |
Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation |
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| XU Zhen-lin,GUO Qi-long,SHEN Yi-cheng,ZHAO Xiong-chao,HONG Yan-ping,GU Zhi-jun.Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation[J].Electrochemistry,2005,11(2):193-198. |
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| Authors: | XU Zhen-lin GUO Qi-long SHEN Yi-cheng ZHAO Xiong-chao HONG Yan-ping GU Zhi-jun |
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| Abstract: | The purpose of this article is to provide a new technology of electroless copper plating without palladium activation steps. By combining the technology of laser micro-etching with the new copper-plating bath, copper plating on ceramics was obtained. The experimental results showed that the solution used for copper electroless plating was stable and the copper coating obtained was bright,dense with good electrical conductivity.The line definition was about 40 μm. The electroless Cu films deposited from this system were gentle and required simple operating conditions. |
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| Keywords: | Ceramic Electrolesscopperplating Activation Complexant Metallization Interconnection |
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