导通孔填充镀铜技术 |
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引用本文: | 蔡积庆[译].导通孔填充镀铜技术[J].印制电路信息,2013(10):47-51. |
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作者姓名: | 蔡积庆[译] |
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作者单位: | 江苏南京210018 |
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摘 要: | 概述了导通孔填充镀铜技术的应用和工艺条件,贯通孔填充和Si贯通电极(TSV)填充等其它的填充镀铜技术和今后的展望。
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关 键 词: | 导通孔填充 贯通孔填充 Si贯通电极 电镀铜 |
Via filling Electroplating Copper Technology |
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Institution: | CAI Ji-qing |
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Abstract: | This paper describes application and process condition of via filling electroplating copper technology, through hole filling and via (TSV) filling etc. and other filling electroplating copper technology and prospect in the future. |
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Keywords: | Via Filling Through Hole Filling Through Silicon Via Electroplating Copper |
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