Low Temperature Bonding of Ceramics by Sol-Gel Processing |
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Authors: | CJ Barbé DJ Cassidy G Triani BA Latella DRM Mitchell KS Finnie JR Bartlett JL Woolfrey GA Collins |
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Institution: | (1) ANSTO Materials Division, PMB1 Menai, NSW 2234, Australia |
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Abstract: | Sol-gel bonds were produced between smooth, clean silicon or polycrystalline alumina substrates by spin-coating solutions containing partially hydrolysed silicon alkoxides onto both substrates. The two coated substrates were assembled and the resulting sandwich was fired at temperatures ranging from 300 to 600°C. The influence of the sol-gel chemistry on the film microstructure and interfacial fracture energy was investigated using a wide range of techniques, including ellipsometry, FTIR, TG-DTA, rheology, TEM and micro-indentation. For silicon wafers, an optimum water-alkoxide molar ratio of 10 and hydrolysis water pH of 2 were found. Such conditions led to relatively dense films (>90%), resulting in bonds with significantly higher fracture energy (3.5 J/m2) than those obtained using classical water bonding (typically 1.5 J/m2). Aging of the coating solution was found to decrease the bond strength. Poly-crystalline alumina substrates were similarly bonded at 600°C; the optimised silica sol-gel chemistry yielded interfaces with fracture energy of 4 J/m2. |
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Keywords: | sol-gel films bonding silica alumina spincoating |
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