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电化学交流阻抗技术表征自组装多层膜
引用本文:程志亮,杨秀荣. 电化学交流阻抗技术表征自组装多层膜[J]. 分析化学, 2001, 29(1): 6-10
作者姓名:程志亮  杨秀荣
作者单位:国家电化学和光谱研究分析中心,
基金项目:国家自然科学基金资助课题 !(No .2 9845 0 0 2 )
摘    要:采用电化交流阻抗技术对一种新型电极表面修饰的自组装多层膜进行表征,通过阻抗谱分析,得出电荷传递电阻和双电层电容与膜层数的关系,证明该多层膜随数增加具有均匀增长,结构致密等特性.

关 键 词:电化学阻抗 交流 自组装多层膜 表征 修饰电极

Characterization of Multilayer Film Using Electrochemical Impedance Spectroscopy
Cheng Zhiliang,Yang Xiurong. Characterization of Multilayer Film Using Electrochemical Impedance Spectroscopy[J]. Chinese Journal of Analytical Chemistry, 2001, 29(1): 6-10
Authors:Cheng Zhiliang  Yang Xiurong
Affiliation:Cheng Zhiliang,Yang Xiurong *
Abstract:A new multilayer film fabricated based on electrostatic attraction in this laboratory was firstly characterized by the electrochemical impedance spectroscopy. The relationship between the charge transfer resistance and double layer capacitance with the number of layers was obtained through analyzing the impedance data. It demonstrated that the multilayer film showed a unique structure with the film growth. Compared to other electrochemical methods, the electrochemical impedance spectroscopy was proved to be a very sensitive and useful technique for characterizing the multilayer films.
Keywords:Electrostatic attraction   multilayer film   electrochemical impedance spectroscopy
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