Kinetics and mechanism of copper fracture due to deformation in surface-active paths

The general kinetic characteristics of copper fracture in the presence of surface-active bismuth-lead baths during creep and elongation under tension are explained. It is shown that the subcritical stage of crack development controls the process, whereupon the effects of stresses , temperature, strain rate , surface energy at the copper-bath interface _SL, and surface energy at the grain boundaries _b on the rate of crack development l/ are analyzed. The basic conclusions are that: a)l/=(–) ( and being constants here); b) the crack development activating energy ) the reduction of energy _b, achieved by intergranular internal adsorption of 0.5% antimony, lowers the value of about 50 times; d) a 30% increase in surface energy _SL reduces the cracking rate 30 times, according to the relation (where A=6 · 10^–15 cm²); and e) .Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 5, pp. 7–15, May, 1976.