Dry etch chemistries for TiO2 thin films

Several different plasma chemistries were investigated for dry etching of TiO₂ thin films. Fluorine-based discharges produced the fastest etch rates (∼2000 Å min⁻¹) and selectivities >1 for Si over TiO₂. Chlorine-based discharges also showed a chemical enhancement over pure Ar sputtering and had selectivities <1 for Si over TiO₂ for a range of plasma conditions. Methane–hydrogen discharges produced very slow etch rates, below those obtained with Ar sputtering. The etched surface morphologies of TiO₂ were excellent in all three types of plasma chemistry. Small concentrations (2 at.%) of chlorine- or fluorine-containing residues were identified on the TiO₂ surface after Cl₂/Ar or SF₆/Ar etching, but these residues were water soluble.