A copper- and boron-related defect in silicon |
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Authors: | J Hage H Prigge P Wagner |
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Institution: | (1) Wacker-Chemitronic GmbH, P.O. Box 1140, D-8263 Burghausen, Fed. Rep. Germany |
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Abstract: | The resistivity of boron-doped silicon can be significantly increased by polishing such material with an appropriate amine- and copper-containing slurry. This effect is ascribed to a passivation of the boron acceptors by a defect produced or introduced by the polishing process. Three new, so far unknown localized vibrational modes at 691, 720, and 1038 cm–1 are observed in highly boron-doped silicon samples after such a polishing treatment. Two of these localized modes can be identified as due to a boron-containing defect. High concentrations of copper found in the samples after appropriate polishing indicate a participation — either directly or indirectly — of this metal in the passivation process. |
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Keywords: | 61 70 78 30 |
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