透明材料的激光标刻工艺

红外器件的封装中常需用一些透明材料制成零部件，适合采用脉冲激光对其进行切割和标刻加工，但需要对加工参数进行精细优化。文中以在用于红外焦平面封装的红外级康宁玻璃基片上进行激光标刻为例，对透明样品进行激光标刻所涉及的一些基本参数，包括烧蚀阈值、激光加工头的光束特性参数以及扫描偏角引起的几何误差等，进行了实际测量和分析，在此基础上得出了合适的打标策略和激光参数，并成功应用于实际操作。此种策略和参数设置方法可以推广到对其他透明材料进行激光标刻。

Laser marking process on transparent materials

In the package of infrared device some components made of transparent materials are often needed, dicing and marking such components by using pulse laser are favorite, whereas the processing parameters should be precisely optimized. Targeting on the laser marking of IR grade Conning glass for packaging of infrared focal plane arrays, the essential parameters including ablation threshold, beam features of laser processing head and geometrical error caused by scanning angle, were measured and analyzed. Suitable strategies and parameters for the laser marking process were gained based on the results, and applied to practical operation successfully. Those strategies and parameter setting methods could be extended to the laser marking of other transparent materials.