| 基于超声扫描显微镜的金属封装检测研究 |
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| 引用本文： | 魏鹏,周庆亚,连军莉,黄晓鹏.基于超声扫描显微镜的金属封装检测研究[J].电子工业专用设备,2013(6):40-41,49. |
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| 作者姓名： | 魏鹏 周庆亚 连军莉 黄晓鹏 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所 |
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| 摘 要： | 基于超声扫描显微镜,对金属封装的声学特性进行分析,结果表明,超声扫描显微镜可实现对金属封装焊缝缺陷的定性、定位、定量检测。
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| 关 键 词： | 超声扫描 显微镜 扫描方式 |
Research on the Metal Package the Scanning Acoustic Microscope |
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| WEI Peng,ZHOU Qingya,LIAN Junli,HUANG Xiaopeng.Research on the Metal Package the Scanning Acoustic Microscope[J].Equipment for Electronic Products Marufacturing,2013(6):40-41,49. |
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| Authors: | WEI Peng ZHOU Qingya LIAN Junli HUANG Xiaopeng |
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| Institution: | (The 45thResearch Institute of CETC,Beijing 100176,China) |
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| Abstract: | This paper invents the Metal Package on the foundation of echo scanning based on the Scanning Acoustic Microscope. It shows that the Scanning Acoustic Microscope. Can not only identifies and locates the defect, but also precisely measures the defect size. |
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| Keywords: | Scanning acoustic Microscope Scanning mode |
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