| 硫脲浸出银及其机理的探讨 |
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| 引用本文： | 程德平,夏式均.硫脲浸出银及其机理的探讨[J].浙江大学学报(理学版),1996,23(1):39-44. |
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| 作者姓名： | 程德平 夏式均 |
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| 摘 要： | 本文探讨了硫脲浸出银的微观机理及银和硫脲的Ｅ－ｐＨ图，在２５℃下，硫脲浓度，Ｆｅ＾３＋浓度及ｐＨ是影响浸出平衡的主要因素，试验确定硫脲浸出银的适宜条件。
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| 关 键 词： | 银 硫脲 浸出 湿法冶炼 |
Study on Silver Leaching by Thiourea and Discussion of Micromechanism |
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| Cheng Deping, Xia Shijun.Study on Silver Leaching by Thiourea and Discussion of Micromechanism[J].Journal of Zhejiang University(Sciences Edition),1996,23(1):39-44. |
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| Authors: | Cheng Deping Xia Shijun |
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| Institution: | Department of Chemical Science and Technology |
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| Abstract: | |
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| Keywords: | silver thiourea mechanism |
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