粘接界面特性的超声检测与评价

粘接界面特性的超声检测与评价既是物理学的前沿问题,又是经济建设和国防安全亟需解决的应用问题。高波阻介质下多层低波阻介质界面脱粘检测、滑移界面检测和粘接强度定量评价是粘接质量检测中遇到的三大难题。本文综述了课题组十余年来在攻坚三大难题方面的研究工作：建立了共振匹配理论,发明了六项关键技术并实现了技术集成,研制出全新概念的超声检测设备,解决了第一个难题；成功研制出横波直探头,用纵横波综合判断方法解决了第二个难题；对第三个难题,建立了粘接界面非线性弹簧模型,为利用非线性声学参量评价粘接界面奠定了理论基础,并探索性地利用统计性方法对粘接强度进行了预测,取得较好效果。

Ultrasonic testing and evaluation of bonding interface properties

Ultrasonic testing and evaluation of bonding interface properties is not only a frontier topic in physics but also an urgent application subject to be solved in development of state economy and security. There are mainly three difficult problems in the evaluation of adhesive bonding quality including detection of debonding in layered soft media under a hard shell, detection of slipping interface and evaluation of bonding strength. This paper reviews our researches aiming at the theoretical and technical solutions to those three problems. The first problem is solved by the development of a new concept system through six technical inventions and integration based on the resonant matching theory. The slipping interface is also satisfactorily solved by longitudinal and shear wave combination test technique on invention of a shear wave transducer with normal radiating direction. The nonlinear spring model is theoretically established, which lays a foundation for the evaluation of bonding interface by nonlinear acoustic parameters. Reasonable results are achieved by applying the statistical methods to the prediction of bonding strength.