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Thermographical Analysis of Paper During Tensile Testing and Comparison to Digital Image Correlation
Authors:A. Hagman  M. Nygårds
Affiliation:1.BiMaC Innovation, Department of Solid Mechanics, School of Engineering Sciences,KTH Royal Institute of Technology,Stockholm,Sweden;2.BiMaC Innovation, INNVENTIA AB,Stockholm,Sweden
Abstract:The thermal response in paper has been studied by thermography. It was observed that an inhomogeneous deformation pattern arose in the paper samples during tensile testing. In the plastic regime a pattern of warmer streaks could be observed in the samples. On the same samples digital image correlation (DIC) was used to study local strain fields. It was concluded that the heat patterns observed by thermography coincided with the deformation patterns observed by DIC. Because of its fibrous network structure, paper has an inhomogeneous micro-structure, which is called formation. It could be shown that the formation was the cause of the inhomogeneous deformations in paper. Finite element simulations was used to show how papers with different degrees of heterogeneity would deform. Creped papers, where the strain at break has been increased, were analysed. For these paper it was seen that an overlaid compaction of the paper was created during the creping process. During tensile testing this was recovered as the paper network structure was strained.
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