| 焊点/底充胶夹层等效弹性常数的简化分析 |
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| 引用本文： | 李英梅,刘军.焊点/底充胶夹层等效弹性常数的简化分析[J].力学与实践,2006,28(3):40-42,18. |
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| 作者姓名： | 李英梅 刘军 |
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| 作者单位： | 东北大学力学系,沈阳,110004;东北大学力学系,沈阳,110004 |
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| 摘 要： | 将高阶逐层离散层板模型和均匀化理论相结合,应用于具有非完全(单层内)周期性微结构的多层结构,用解析法分析了电子封装结构中由焊点和底充胶构成的非均质夹层的等效弹性常数．计算结果与已有结果进行了比较,验证了文中分析方法的有效性和简便性．
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| 关 键 词： | 夹杂 焊点列阵 高阶逐层离散模型 等效弹性常数 |
| 收稿时间： | 2005-05-17 |
| 修稿时间： | 2005-05-172005-11-15 |
EFFECTIVE ELASTIC MODULI ANALYSIS OF INTERLEAF WITH SOLDER JOINTS AND UNDERFILLS |
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| LI Yingmei,LIU Jun.EFFECTIVE ELASTIC MODULI ANALYSIS OF INTERLEAF WITH SOLDER JOINTS AND UNDERFILLS[J].Mechanics and Engineering,2006,28(3):40-42,18. |
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| Authors: | LI Yingmei LIU Jun |
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| Institution: | Department of Mechanics, Northeastern University, Shenyang 110004, China |
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| Abstract: | In this paper, the homogenization theory and higher order discrete-layer laminate model are applied to the flip-chip electronic package assemblies with underfills, with microstructures not completely periodic (single layer). The effective elastic properties for a laminar with BGA and underfills are determined by an analytic method. The numerical results are compared with the previous solutions, which shows the efficiency of the present model and method. |
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| Keywords: | inclusion BGA higher order discrete-layer model effective elastic properties |
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