| 论失效分析方法及流程 |
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| 引用本文： | 王起,王时光.论失效分析方法及流程[J].电子测试,2020(3):47-48. |
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| 作者姓名： | 王起 王时光 |
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| 作者单位： | 天水生产力促进中心;天水市高新技术创业服务中心 |
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| 摘 要： | 随着微电子业的飞速发展,失效分析广泛应用于宇航、工业、军品和民用产品中。失效分析是对失效器件进行分析检查,找出失效发生的原因,从而为改进、提高器件可靠性指明方向,在可靠性工程中具有重要的作用。
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| 关 键 词： | 封装 元器件 失效分析 |
Discussion on failure analysis method and process |
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| Wang Qi,Wang Shiguang.Discussion on failure analysis method and process[J].Electronic Test,2020(3):47-48. |
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| Authors: | Wang Qi Wang Shiguang |
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| Institution: | (Tianshui Productivity Promotion Center,Tianshui Gansu,741000;Tianshui City High-tech Entrepreneurship Service Center,Tianshui Gansu,741000) |
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| Abstract: | Failure analysis is with the rapid development of Microelectronics,It is widely used in aerospace,military,industrial and civil products.Failure analysis is to analyze the failure device and find out the cause of the failure,so as to improve the reliability of the device,So failure analysis plays an important role in reliability engineering. |
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| Keywords: | Package Components failure analysis |
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