Studies on the Thermal Properties of Epoxy Resins Modified with Two Kinds of Silanes |
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| Authors: | Songqi Ma Weiqu Liu Qianqian Su Yunfeng Liu |
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| Affiliation: | 1. Key Laboratory of Polymer Materials for Electrons, Guangzhou Institute of Chemistry, Chinese Academy of Sciences , Guangzhou, Guangdong, China;2. Graduate University of Chinese Academy of Sciences , Beijing, China;3. Key Laboratory of Polymer Materials for Electrons, Guangzhou Institute of Chemistry, Chinese Academy of Sciences , Guangzhou, Guangdong, China |
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| Abstract: | Dimethyldiethoxysilane (DMDES) and diphenyldimethoxysilane (DPDMS)-containing epoxy resins were synthesized by dehydration polycondensation. The chemical structures were determined by FT-IR, 1H NMR, and 13C NMR. The cured samples, with 4, 4′-diaminodiphenylmethane (DDM) as curing agent, were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), scanning electron microscopy (SEM), and tensile and impact testing. Results showed that DMDES and DPDMS-modified epoxy resins possess higher glass transition temperatures, better thermal stability, and better fracture toughness than the neat epoxy resin. |
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| Keywords: | dehydration polycondensation epoxy resins silicon modification thermal properties toughness |
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