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Studies on the Thermal Properties of Epoxy Resins Modified with Two Kinds of Silanes
Authors:Songqi Ma  Weiqu Liu  Qianqian Su  Yunfeng Liu
Institution:1. Key Laboratory of Polymer Materials for Electrons, Guangzhou Institute of Chemistry, Chinese Academy of Sciences , Guangzhou, Guangdong, China;2. Graduate University of Chinese Academy of Sciences , Beijing, China;3. Key Laboratory of Polymer Materials for Electrons, Guangzhou Institute of Chemistry, Chinese Academy of Sciences , Guangzhou, Guangdong, China
Abstract:Dimethyldiethoxysilane (DMDES) and diphenyldimethoxysilane (DPDMS)-containing epoxy resins were synthesized by dehydration polycondensation. The chemical structures were determined by FT-IR, 1H NMR, and 13C NMR. The cured samples, with 4, 4′-diaminodiphenylmethane (DDM) as curing agent, were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), scanning electron microscopy (SEM), and tensile and impact testing. Results showed that DMDES and DPDMS-modified epoxy resins possess higher glass transition temperatures, better thermal stability, and better fracture toughness than the neat epoxy resin.
Keywords:dehydration polycondensation  epoxy resins  silicon  modification  thermal properties  toughness
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