| 不同板材密集散热孔耐热性能对比与分析 |
| |
| 引用本文： | 张可,乔书晓.不同板材密集散热孔耐热性能对比与分析[J].印制电路信息,2010(Z1):551-560. |
| |
| 作者姓名： | 张可 乔书晓 |
| |
| 作者单位： | 深圳市兴森快捷电路科技股份有限公司 |
| |
| 摘 要： | 随着线路板不断向高密度化方向发展,客户设计散热过孔的孔壁间距也随之减少,密集散热孔在热应力测试后出现分层的风险也相应加大。为了降低此类风险,我们测试并分析了不同板材、不同孔壁间距对分层的影响,为生产和设计提供了有价值的参考。
|
| 关 键 词： | 板材 密集散热孔 热应力 分层 |
The contrast and analysis of the heat-resistant performance of different materials on high density thermal via |
| |
| ZHANG Ke,QIAO Shu-xiao.The contrast and analysis of the heat-resistant performance of different materials on high density thermal via[J].Printed Circuit Information,2010(Z1):551-560. |
| |
| Authors: | ZHANG Ke QIAO Shu-xiao |
| |
| Institution: | ZHANG Ke QIAO Shu-xiao |
| |
| Abstract: | As PCB is developing higher and higher densely,the distance between thermal via designed by customers is much less than before.When the thermal via comes more close,the risk of delamination of PCB becomes higher after thermal stress.In order to decrease this kind of risk,we tested and analyzed the infiuence of delamination with different kinds of material and different thermal via distance.This article offers valuable reference for manufacture and design. |
| |
| Keywords: | Base material High density thermal via Thermal stress Delamination |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
