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Patterned deposition by plasma enhanced spatial atomic layer deposition
Authors:Paul Poodt  Bas Kniknie  Annalisa Branca  Hans Winands  Fred Roozeboom
Affiliation:1. TNO, PO Box 6235, 5600 HE Eindhoven, The Netherlands;2. Eindhoven University of Technology, Dept. of Applied Physics, PO Box 513, 5600 MB Eindhoven, The Netherlands
Abstract:An atmospheric pressure plasma enhanced atomic layer deposition reactor has been developed, to deposit Al2O3 films from trimethyl aluminum and an He/O2 plasma. This technique can be used for 2D patterned deposition in a single in‐line process by making use of switched localized plasma sources. It was observed that the sharpness of the patterns is primarily influenced by the concentration of reactive plasma species and by the dimensions of the plasma source. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
Keywords:atomic layer deposition  plasma‐enhanced deposition  patterning  alumina
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