Synthesis of poly(silmethylene)s via ring‐opening polymerization of benzocyclobutene functionalized disilacyclobutene and their low‐dielectric and thermal properties |
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| Authors: | Yawen Huang Shengbo Zhang Huan Hu Xiaonan Wei Hongtao Yu Junxiao Yang |
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| Institution: | 1. State Key Laboratory Cultivation Base for Nonmetal Composite and Functional Materials, Southwest University of Science and Technology, Mianyang, China;2. School of Material Science and Engineering, Southwest University of Science and Technology, Mianyang, Sichuan, China |
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| Abstract: | In this work, benzocyclobutene‐introduced poly(silmethylene)s were synthesized by ring‐opening copolymerization of benzocyclobutene (BCB) functionalized disilacyclobutene with phenyldisilacyclobutene. The incorporation ratio of BCB was tailored by changing feeding ratio of 1,3‐dimethyl‐1,3‐dibenzocyclobutene‐1,3‐disilacyclobutane and 1,3‐dimethyl‐1,3‐diphenyl‐1,3‐disilacyclobutane, thus enabling the control of ultimate properties of cured resins. With increasing the incorporation ratios of BCB from 9.5 to 28.9 mol%, T5% of cured resins is improved from 404°C to 462°C, while the dielectric constant is decreased from 2.59 to 2.41 at 10 MHz. The excellent thermal stability and low‐dielectric performance make such thermosets potential inter‐layered or inter‐lined low‐dielectric media. Copyright © 2017 John Wiley & Sons, Ltd. |
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| Keywords: | benzocyclobutene disilacyclobutene cross‐linking thermal stability low dielectric |
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