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Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards
Authors:Attila Géczy  Balázs Illés  Zsolt Péter  Zsolt Illyefalvi-Vitéz
Institution:1. Department of Electronics Technology, Budapest University of Technology and Economics, Egry J. u. 18., V1 Building, V1-013, Budapest, 1111, Hungary
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