Ferroelectric materials for dynamic-memory integrated circuits

The possibilities of using ferroelectric materials for new generations of integrated circuits for high-density dynamic memory (up to 1 Gbit per crystal) are discussed. The correspondence of the specific capacitance and leakage currents of thin film ferroelectric capacitors to the requirements for integrated circuits with various information capacities is examined. It is shown that the capacitance-voltage characteristic of the ferroelectric strongly influences the specific capacitance and the rate of decrease of the voltage across the capacitors when they are discharged in the process of storing information. The prospects for increasing the specific capacitance of memory capacitors using relaxor ferroelectrics are examined. Zh. Tekh. Fiz. 69, 89–92 (May 1999)