| 电子封装、QFP和MCM热变形的实验及数值分析 |
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| 引用本文： | Yasuyuki Morita,Kazuo Arakawa,Mitsugu Todo. 电子封装、QFP和MCM热变形的实验及数值分析[J]. 实验力学, 2006, 21(1) |
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| 作者姓名： | Yasuyuki Morita Kazuo Arakawa Mitsugu Todo |
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| 作者单位： | Research Institute for Applied Mechanics Kyushu University 6-1 Kasuga-koen Kasuga-shi Fukuoka 816-8580 Japan，Research Institute for Applied Mechanics Kyushu University 6-1 Kasuga-koen Kasuga-shi Fukuoka 816-8580 Japan，Research Institute for Applied Mechanics Kyushu University 6-1 Kasuga-koen Kasuga-shi Fukuoka 816-8580 Japan |
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| 基金项目： | ThisresearchwassupportedbyagrantfromtheShoraiFoundationforScienceandTechnology. |
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| 摘 要： | 0Introduction Anelectronicpackageisgenerallyconstructedwithanactivesiliconchip,mountisland,gold wires,leadframesandsoldersasshowninFig.1(a).Toprotectfromtheenvironment,thesilicon chipisusuallyencapsulatedinresin.SincethesematerialshavedifferentCTE(coeffic…
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| 关 键 词： | electronic package Moiré interferometry thermal deformation displacement field QFP MCM PCB coefficient of thermal expansion finite element analysis |
Experimental and Numerical Analysis of Thermal Deformation of Electronic Packages,QFP and MCM |
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| Yasuyuki Morita,Kazuo Arakawa,Mitsugu Todo. Experimental and Numerical Analysis of Thermal Deformation of Electronic Packages,QFP and MCM[J]. Journal of Experimental Mechanics, 2006, 21(1) |
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| Authors: | Yasuyuki Morita Kazuo Arakawa Mitsugu Todo |
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| Abstract: | Moiré inteferometry and FEA (finite element analysis) were used to evaluate the thermal deformation of two electronic packages, QFP (quad flat package) and MCM (multi chip module).Thermal loading was applied by cooling the packages from 100℃ to room temperature (25℃). Moiré fringes were obtained on the cross sections of the packages to clarify the effect of the CTE (coefficient of thermal expansion) mismatch of the micro components, such as silicon, metal and resin. In QFP, the effects of packaging resin and PCB (printed circuit board) on the thermal deformation were investigated. The effect of location of three silicon chips in MCM was also examined. |
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| Keywords: | electronic package thermal deformation displacement field QFP MCM PCB coefficient of thermal expansion finite element analysis |
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