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Numerical Study on a Lateral Double-Gate Tunnelling Field Effect Transistor
作者姓名:何进  边伟  陶亚东  刘峰  宋岩  张兴
作者单位:[1]Shenzhen Graduate School, Peking University, Senzhen, 518055 [2]Multi-Project-Wafer (MPW) Center, Institute of Microelectronics, School of Electroni;VEngineering and Computer Science, Peking University, Beijing 100871
基金项目:Supported by the National Bazic Research Program of China under Grant No 2006CB302704, and the National Natural Science Foundation of China under Grant No 90607017.
摘    要:A novel lateral double-gate tunnelling field effect transistor (DG-TFET) is studied and its performance is presented by a two-dimensional device simulation with code ISE. The result demonstrates that this new tunnelling transistor allows for the steeper sub-threshold swing below 60mV/dec, the super low supply voltage (operable at VDD 〈 0.3 V) and the rail-to-rail logic (significant on-state current at the drain-source voltage VDS = 50mV) for the aggressive technology assumptions of the availability of high-k/metal stack with equivalent gate oxide thickness EOT =0.24 nm and the work function difference 4.5 eV of materials.

关 键 词:侧向多门  穿隧式场效应晶体管  数值模拟  输出特性
收稿时间:2006-03-25
修稿时间:2006-03-25

Numerical Study on a Lateral Double-Gate Tunnelling Field Effect Transistor
HE Jin,BIAN Wei,TAO Ya-Dong,LIU Feng,SONG Yan,ZHANG Xing.Numerical Study on a Lateral Double-Gate Tunnelling Field Effect Transistor[J].Chinese Physics Letters,2006,23(12):3373-3375.
Authors:HE Jin  BIAN Wei  TAO Ya-Dong  LIU Feng  SONG Yan  ZHANG Xing
Institution:1.Shenzhen Graduate School, Peking University, Senzhen, 518055 ;2.Multi-Project-Wafer (MPW
Abstract:A novel lateral double-gate tunnelling field effect transistor (DG-TFET) is studied and its performance is presented by a two-dimensional device simulation with code ISE. The result demonstrates that this new tunnelling transistor allows for the steeper sub-threshold swing below 60 mV/dec, the super low supply voltage (operable at VDD<0.3 V) and the rail-to-rail logic (significant on-state current at the drain-source voltage VDS=50 mV) for the aggressive technology assumptions of the availability of high-k/metal stack with equivalent gate oxide thickness EOT=0.24 nm and the work function difference 4.5 eV of materials.
Keywords:85  30  Mn  85  30  Tv  85  30  -p
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