| IC Surface Corrosion Inspection by C-Mode Scanning Acoustic Microscopy |
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| 作者姓名： | Li-Li Ma Sheng-Xiang Bao De-Chun Lu Zhi-Bo Du |
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| 作者单位： | State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China （UESTC）, Chengdu, 610054,China |
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| 摘 要： | C-mode scanning acoustical microscopy, C-SAM, is widely used in plastic package evaluations and for failure analysis. It permits to detect subsurface delaminations, cracks and pores （air bubbles） for different microelectronics packages. In this study, abnormality was observed in C-SAM daily test, the images showed no delaminations but inhomogeneities on the IC surface. Corrosion was found by optical microscope and scanning electron microscope after decapsulation. It can be revealed as the acoustic impedance is different between corrosion and normal area. The presence of inhomogeneities and discontinuities along ultrasonic waves＇ propagation paths inside the matter causes modifications in the amplitude and polarity of ultrasonic waves. However, C-SAM＇s capability in detecting IC surface corrosion has not been presented. The capability will be illustrated and the inspection mechanism will be discussed in this paper.
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| 关 键 词： | 集成电路 表面腐蚀 故障分析 扫描声显微镜 |
| 收稿时间： | 2007-08-12 |
| 修稿时间： | 2007-09-10 |
IC Surface Corrosion Inspection by C-Mode Scanning Acoustic Microscopy |
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| Li-Li Ma Sheng-Xiang Bao De-Chun Lu Zhi-Bo Du.IC Surface Corrosion Inspection by C-Mode Scanning Acoustic Microscopy[J].Journal of Electronic Science Technology of China,2007,5(4):336-339. |
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| Authors: | Li-Li Ma Sheng-Xiang Bao De-Chun Lu Zhi-Bo Du |
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| Abstract: | Cmode scanning acoustical microscopy,CSAM, is widely used in plastic package evaluations and for failure analysis. It permits to detect subsurface delaminations, cracks and pores (air bubbles) for different microelectronics packages. In this study, abnormality was observed in CSAM daily test, the images showed no delaminations but inhomogeneities on the IC surface.Corrosion was found by optical microscope and scanning electron microscope after decapsulation. It can be revealed as the acoustic impedance is different between corrosion and normal area. The presence of inhomogeneities and discontinuities along ultrasonic waves' propagation paths inside the matter causes modifications in the amplitude and polarity of ultrasonic waves. However, CSAM's capability in detecting IC surface corrosion has not been presented. The capability will be illustrated and the inspection mechanism will be discussed in this paper. |
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| Keywords: | Corrosion delamination failure analysis package scanning acoustic microscopy |
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