铝焊垫俄歇分析中荷电效应影响及其降低方法

铝焊垫表面残留物的检测是确保铝焊垫质量的重要指标.俄歇电子能谱仪(AES)由于检测区域小、表面分析灵敏度高,被广泛用于集成电路(IC)芯片制造中铝焊垫的表面成分分析,但荷电效应的存在常常会影响俄歇分析的结果.铝焊垫分析过程中,消除或者减少荷电效应是保证俄歇分析结果正确的前提.从优化俄歇电子能谱仪分析条件(比如降低入射电压、倾斜样品载物台、Ar+离子中和)和使用辅助方法改善样品导电性两大方面,介绍了几种减少荷电效应的有效方法,提出了铝焊垫俄歇分析的基本流程.结果表明,此分析流程能有效提高分析效率,为业内俄歇分析人员提供借鉴.

Charging Effect and Reducing Methods During Auger Analysis for Aluminum Bonding Pads

Aluminum bonding pad surface residue detection is an important indicator to ensure the quality of aluminum bonding pads.Auger electron spectrometer (AES) has been widely employed in the surface composition analysis of the aluminum bonding pads for integrated circuits (ICs) chip manufacturing because of AES's precision and sensitivity in localized surface analysis.However,charging effect during the AES testing has negative impacts on the experimental result.During AES analysis for aluminum bonding pads,prevention or reduction of the charging effect is the prerequisite condition for accurate AES data analysis.Some effective methods to reduce the charging effect and their application process were introduced by optimizing the AES analysis conditions (such as lower the incident voltage,tilting the sample holder and Ar+ ion compensation) and using aiding methods to improve the conductivity of AES samples.And the general flow of Auger analysis for aluminum bonding pads was presented.The results show that the general flow can improve the analysis efficiency,which will provide reference for AES researchers.