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6H-SiC单极功率器件性能的温度关系
引用本文:何进,张兴.6H-SiC单极功率器件性能的温度关系[J].半导体学报,2001,22(10):1235-1239.
作者姓名:何进  张兴
作者单位:北京大学微电子学研究所,北京100871
摘    要:基于碳化硅材料电离系数和迁移率的温度依赖性 ,利用有效电离系数的 Fulop近似 ,推出了 6 H- Si C单极性功率器件击穿电压和比导通电阻的温度依赖性解析表达式 .理论预言的击穿电压和临界电场与先前的实验结果基本一致 (误差小于 10 % ) ,验证了理论模型的适用性

关 键 词:宽禁带半导体器件    6H-SiC    电离系数    雪崩击穿    比导通电阻    温度关系
文章编号:0253-4177(2001)10-1235-05
修稿时间:2001年3月16日

Temperature Dependence of Performance of 6H-SiC Unipolar Power Devices
HE Jin,ZHANG Xing.Temperature Dependence of Performance of 6H-SiC Unipolar Power Devices[J].Chinese Journal of Semiconductors,2001,22(10):1235-1239.
Authors:HE Jin  ZHANG Xing
Abstract:The temperature dependence of some performance of 6H SiC unipolar power devices is analyzed theoretically.By employing the temperature dependent ionization coefficient and mobility of a silicon carbide,the analytical expressions of the temperature dependent performance,such as breakdown characteristics and on resistance of 6H SiC unipolar power devices are derived in a closed form.The analytical results are compared with the experimental results,with good accordance found in the breakdown characteristics.
Keywords:wide band gap semiconductor devices  6H SiC  impact ionization coefficient  avalanche breakdown  on resistance  temperature dependence of performance
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