Laser printing of conformal and multi-level 3D interconnects

A crucial challenge in three-dimensional multi-chip assemblies is to establish electrical connections between discrete devices. Here, we apply laser printing of congruent voxels of silver nanopaste for the fabrication of conformal and 3D multi-level interconnects. By controlling laser fluence, various 3D electrodes including freestanding tabs and side contacts over vertical walls can be directly printed without the need for sacrificial layers, chemical etching or electroplating. The electrical characteristics of the printed interconnects are similar to those currently in use by the semiconductor industry. These results are a promising step forward in the generation of customized interconnects for 3D microelectronics.