| 铝电解电容器用低压箔接触电阻超标分析 |
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| 引用本文： | 洪涛,王兰东,董晓红.铝电解电容器用低压箔接触电阻超标分析[J].电子元件与材料,2005,24(11):39-41. |
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| 作者姓名： | 洪涛 王兰东 董晓红 |
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| 作者单位： | 新疆众和股份有限公司,新疆,乌鲁木齐,830013 |
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| 摘 要： | 通过金相分析和铝箔铆接后的接触电阻对比,研究了铝箔的腐蚀形貌、铝箔表面粉状物、氧化膜厚度、引线质量、铆接工序控制等对接触电阻的影响。提出了降低接触电阻的几点建议:①采用多级变频复合腐蚀工艺,以得到“乔木状”的蚀孔。②改进处理工艺,减少粉状物的产生。③调整工艺控制条件,改善腐蚀形貌。
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| 关 键 词： | 电子技术 铝电解电容器 铝箔 接触电阻 |
| 文章编号： | 1001-2028（2005）11-0039-03 |
| 收稿时间： | 2005-06-10 |
| 修稿时间： | 2005-06-10 |
Analysis of Contact Resistance Problem of Low Voltage Al Foil for Electrolytic Capacitor |
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| HONG Tao,WANG Lan-dong,DONG Xiao-hong.Analysis of Contact Resistance Problem of Low Voltage Al Foil for Electrolytic Capacitor[J].Electronic Components & Materials,2005,24(11):39-41. |
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| Authors: | HONG Tao WANG Lan-dong DONG Xiao-hong |
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| Institution: | XinJiang Joinworld Co., Ltd, Urumqi 830013, China |
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| Abstract: | The effects of Al foil morphology,powder on the Al foil surface,thickness of Al2O3 film,lead quality,control of vivet joint on contact resistance were studied by the means of metallographical analysis and comparisons of contact resistances after rivet joint for Al foils.Some suggests were advanced: ① multistage frequency conversion composite etching technology is used to obtain “arbon-from” etching holes.② treatment technology is improved to reduce powder on the Al foil surface.③ control conditions of technology is regulated to improve etching morphology. |
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| Keywords: | electronic technology aluminum electrolytic capcitors aluminum foil contact resistance |
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