Optimization of CuW alloy electrodeposition towards high-tungsten content

With the help of the factorial design of experiments, optimization of the deposition of the CuW alloy was successfully done. The important deposition parameters were identified as pH, current density, and—the most important one—copper ion concentration. All of them were examined in their wide ranges. Under optimal conditions, in a citrate bath, with copper ion concentration of 1.0 mM, at current density of −100 mA cm⁻² and at pH ca. 8.3, the alloy layer had the highest tungsten content (circa 30 wt.%), satisfactory adhesion and a smooth and crackless morphology. The structure of the electrodeposited alloy can be described as an amorphous solid solution of Cu in W with built-in Cu nanocrystals.