| 散热型挠性线路板 |
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| 引用本文： | 王艾戎,龚莹.散热型挠性线路板[J].印制电路信息,2005(5):42-45. |
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| 作者姓名： | 王艾戎 龚莹 |
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| 作者单位： | 七○四厂研究所 |
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| 摘 要： | 介绍一种散热性能优异的散热材料——セラックa及用该材料制成散热型挠性线路板的特点、性能。
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| 关 键 词： | 散热材料セラックa 散热型挠性线路板 特点 性能 |
Heat Dissipation Flexible Printed Circuits |
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| WANG Airong,Gong Ying.Heat Dissipation Flexible Printed Circuits[J].Printed Circuit Information,2005(5):42-45. |
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| Authors: | WANG Airong Gong Ying |
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| Institution: | Wang Airong Gong Ying |
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| Abstract: | Introduces a heat dissipation material which has excellent performance of heat dissipation, in addition the characteristic and performance of the heat dissipation flexible printed circuits. |
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