Partial filling ofd-band of nickel on hydrogen diffusion

Summary It is seen that low-temperature annealing of nickel wires forbids the complete filling in of thed-band of nickel when the latter is subjected to cathodic-hydrogen diffusion. At a certain low-temperature range irreversible changes occur in the orientation of the surface planes of nickel which persist even if the temperature is raised to the room temperature. To speed up publication, the authors of this paper have agreed to not receive the proofs for correction.