固-液金属界面上金属间化合物的非平衡生长

钎焊过程是一些液态的低熔点金属合金（钎料）与过渡金属（引线）在钎焊温度下相互作用，冷却后形成电路接头的过程1]，其间，金属间化合物生长和存在的特征，极大地影响钎焊接头的强度，抗蠕变性，抗腐蚀性和可焊性，本文拟以纯液态金属与固体金属的快速反应来观察金属间化合物的生长，从而阐述钎焊过程的特征。

Nonequilibrium Growth of Intermetallics at the Interface of Liquid- solid Metal

The growth characteristic of intermetallics during the reaction of solid (Cu,Ag,Au,Fe,Co,Ni,etc) with liquid (Sn,Sb,Bi,Zn) within a very short time of 1～ 2 s at different temperatures has been studied by metallographic method for explaining the process in the fillet during soldering. It is indicated that the incongruent compourds often grow up as bamboo shoot form. But congruent compounds grow up basically just by spreading out as a layer along the solid border. Base on these facts,the influence of intermetallics in the fillet during soldering has been discussed.