Residual stresses in plastically encapsulated microelectronic devices |
| |
| Authors: | K M Liechti |
| |
| Institution: | (1) Aerospace Engineering and Engineering Mechanics Department, University of Texas, 78712 Austin, TX |
| |
| Abstract: | The residual stresses in a model of a plastically encapsulated microelectronic device are determined photoelastically using birefringent transfer-molding compounds. The measured stresses are compared with a laminated-platetheory analysis and then used to guide a two-dimensional finite-element analysis of the device. Photoelasticity was also used to determine the effects of postcure on the residualstress distribution. |
| |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ |
|
