Thickness of SiO2 thin film on silicon wafer measured by dispersive white-light spectral interferometry

We present a white-light spectral interferometric technique for measuring the thickness of SiO₂ thin film on a silicon wafer. The technique utilizes a slightly dispersive Michelson interferometer with a cube beam splitter and a fibre-optic spectrometer to record channelled spectra in two configurations. In the first, a standard configuration with two identical metallic mirrors, the recorded channelled spectrum is fitted to the theoretical one to determine the effective thickness of the beam splitter made of BK7 optical glass. In the second configuration one of the mirrors is replaced by SiO₂ thin film on the silicon wafer and the recorded channelled spectrum is fitted to the theoretical one to determine the thin-film thickness. We consider multiple reflection within the thin-film structure, use the optical constants for all the materials involved in the set-up, and confirm very good agreement between theory and experiment. The technique is applied to four samples with various SiO₂ film thicknesses. PACS 07.60.Ly; 68.55.Jk; 78.20