淬入空位在AuCu有序化过程中的作用

本文通过电阻测量研究了淬火和退火温度对AuCu合金有序化过程的影响,结果表明:1.AuCu合金的有序化过程可分为两个阶段:1)局部有序或有序相成核阶段,电阻上升;2)有序相(或畴)长大阶段,电阻下降。2.淬火后低温退火时,AuCu有序化主要是通过过饱和的淬入空位在金属中的移动而实现的。有序化的速度正比于淬入空位的浓度和移动率。3.通过有序化速度随淬火温度和退火温度的变化,测得AuCu中空位的形成能E_f和移动激活能E_m相应为0.95eV和0.81eV。4.在等温退

THE ROLE OF QUENCHED-IN VACANCIES IN THE ORDERING PROCESS OF AuCu ALLOY

The effect of quenching and aging temperature on ordering process of AuCu alloy was investigated.Based on the experimental results obtained, we concluded that1. The ordering process of AuCu alloy can be divided into two stages: 1) formation of short-range order or nucleation with increase in resistivity, followed by 2) long-range ordering with decrease in resistivity.2. The ordering kinetics of AuCu alloy during low temperature aging is mainly limited by migration of the quenched-in vacancies. The rate of ordering process is proportional to the concentration and mobility of quenched-in vacancies.3. The formation energy and migration energy of vacancies in AuCu were estimated to be 0.95 eV and 0.81 eV respectively.4. During isothermal aging, the quenched-in vacancies in AuCu decayed according to the law of second-order reaction.