ANALYSIS OF NANOBRIDGE TESTS |
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| Authors: | Wing Kin Chan Jianrong Li Yong Wang Shengyao Zhang Tongyi Zhaug |
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| Affiliation: | Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China |
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| Abstract: | This paper analyzes nanobridge tests with consideration of adhesive contact deformation, which occurs between a probe tip and a tested nanobeam, and deformation of a substrate or template that supports the tested nanobeam. Analytical displacement-load relation, including adhesive contact deformation and substrate deformation, is presented here for small deformation of bending. The analytic results are confirmed by finite element analysis. If adhesive contact deformation and substrate deformation are not considered in the analysis of nanobridge test data, they might lead to lower values of Young's modulus of tested nanobeams. |
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| Keywords: | nanobridge tests size-dependency adhesion contact compliance surface effect substrate effect finite element |
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