首页 | 本学科首页   官方微博 | 高级检索  
     检索      

多层板内层铜箔棕化处理液研制
引用本文:符飞燕,黄革,王克军,高四,王龙彪.多层板内层铜箔棕化处理液研制[J].印制电路信息,2013(3):23-26.
作者姓名:符飞燕  黄革  王克军  高四  王龙彪
作者单位:中南电子化学材料所,湖北 武汉 430070
摘    要:文章概述了应用于PCB多层板制作过程中的棕化工艺原理及棕化膜的结构。主要讨论了一种新的棕化处理液,包括配方组成和工艺方法。经实验和应用实践证明,它具有能够显著促进铜面与粘结片的结合力,耐高温热冲击-陛能良好,抗剥离强度高,没有粉红圈,工艺流程简单,适用性广,成本低等特点。

关 键 词:棕化  缓蚀剂  印制线路板  内层处理

Study of multilayer inner foil brown oxide processing solution for PCB
FU Fei-yan,HUANG Ge,WANG Ke-jun,GAO Si,WANG Long-biao.Study of multilayer inner foil brown oxide processing solution for PCB[J].Printed Circuit Information,2013(3):23-26.
Authors:FU Fei-yan  HUANG Ge  WANG Ke-jun  GAO Si  WANG Long-biao
Institution:FU Fei-yan HUANG Ge WANG Ke-jun GAO Si WANG Long-biao
Abstract:This article provides an overview of the structure used in the multilayer PCB production process in the browning process by introducing principles and brown film. It mainly discusses a new brown treatment solution, including the recipe composition and process methods. Experiments and application practice have been proved that it is able to significantly promote the copper surface Prepreg combination of force, high-temperature thermal shock performance, high peel strength, no pink ring. The process is simple, with broad applicability, and low cost.
Keywords:Brown Ooxidation  Corrosion Inhibitor  PCB  Inner Layer Processing
本文献已被 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号