| Study on the delamination of tungsten thin films on Sb2Te3 |
| |
| 作者姓名： | 徐嘉庆 刘 波 宋志棠 封松林 Bomy Chen |
| |
| 作者单位： | Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, Changning Road, Shanghai 200050,China;Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, Changning Road, Shanghai 200050,China;Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, Changning Road, Shanghai 200050,China;Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, Changning Road, Shanghai 200050,China;Silicon Storage Technology, Inc., 1171 Sonora Court,Sunnyvale, CA 94086, USA |
| |
| 基金项目： | Project Supported by the National High Technology Development Program of China (Grant No
2004AA302G20), Science and Technology Council of Shanghai (Grant Nos 0452nm012, 04DZ05612, 04ZR14154, 04JC14080, 05JC14076, AM0414, 05nm05043, Chinese Academy of Sciences (Grant
No Y2005027), and Silicon Storage Technology, Inc. |
| |
| 摘 要： | To investigate the reliability of electrode materials for chalcogenide random access memory （C-RAM） applications, the geometry and time evolution of the worm-like delamination patterns on a tungsten/Sb2Te3 bilayer system surface are observed by field emission scanning electronic microscope （FESEM） and optical microscopy. The tungsten film stress and interface toughness are estimated using a straight-side model. After confirming the instability of this system being due to large compressive stress stored in the tungsten film and relative poor interface adhesion, a preliminary solution as the inset of a TiN adhesion layer is presented to improve the system performances.
|
| 关 键 词： | 分层 附着力 可靠性 电极原料 薄膜 |
| 收稿时间： | 2005-08-25 |
| 修稿时间： | 2005-08-252006-04-29 |
Study on the delamination of tungsten thin films on Sb2Te3 |
| |
| Xu Jia-Qing,Liu Bo,Song Zhi-Tang,Feng Song-Lin and Chen Bomy.Study on the delamination of tungsten thin films on Sb2Te3[J].Chinese Physics B,2006,15(8):1849-1854. |
| |
| Authors: | Xu Jia-Qing Liu Bo Song Zhi-Tang Feng Song-Lin and Chen Bomy |
| |
| Abstract: | To investigate the reliability of electrode materials for chalcogenide
random access memory (C-RAM) applications, the geometry and time evolution
of the worm-like delamination patterns on a tungsten/Sb$_{2}$Te$_{3}$
bilayer system surface are observed by field emission scanning electronic
microscope (FESEM) and optical microscopy. The tungsten film stress and
interface toughness are estimated using a straight-side model. After
confirming the instability of this system being due to large compressive stress
stored in the tungsten film and relative poor interface adhesion, a
preliminary solution as the inset of a TiN adhesion layer is presented to
improve the system performances. |
| |
| Keywords: | C-RAM delamination adhesion |
| 本文献已被 维普 等数据库收录！ |
| 点击此处可从《中国物理 B》浏览原始摘要信息 |
| 点击此处可从《中国物理 B》下载免费的PDF全文 |
|
