超声辅助电镀的仿真与实验*

为了提高镀层的表面质量,提出了一种超声辅助电镀的方法。超声的空化与搅拌作用可以影响电镀的电沉积过程。设计了合理的换能器结构,并搭建了超声辅助电镀装置。通过对模型进行压电声学场与电镀场耦合仿真分析,结果表明：在硫酸铜电解液,镀铜时间60s,电压300V条件下,进行超声辅助电镀,镀层厚度分布均匀,镀层中部电流密度分布均匀,边缘最大电流密度是未加超声的2倍左右 。基于仿真结果,进行相同的实验测试,结果表明：超声辅助电镀可以提高镀层的均匀性,减少铜颗粒表面的杂质,提高表面的光洁度。阴极样品距离换能器头部位置在60mm左右,镀层质量良好。

Simulation and experiment of ultrasonic assisted electroplating

In order to improve the surface quality of the coating, an ultrasonic-assisted electroplating method was proposed. Ultrasonic cavitation and stirring can affect the electrodeposition process of electroplating. A reasonable transducer structure was designed and an ultrasonic assisted electroplating device was built. The coupling simulation analysis of piezoelectric acoustic field and electroplating field was. Results show that under the condition of copper sulfate electrolyte,copper plating time 60s, and voltage 300V, ultrasonic-assisted electroplating coating thickness distribution is uniform, the current density distribution in the middle of the coating is uniform, and the maximum current density at the edge is nearly 2 times larger than that without ultrasound. Based on the simulation results, the same experimental tests were carried out. The results show that ultrasonic-assisted electroplating can improve the uniformity of the coating, reduce the impurities on the surface of copper particles, and improve the surface finish. When the cathode sample is about 60mm away from the head of the transducer, the coating quality is good.