Use of digital color holography for crack investigation in electronic components

This paper presents the experimental optical analysis of the crack inside an electronic component. The optical setup is used to carry out multidimensional deformation measurements using digital color holography and the spatial multiplexing of holograms. Since the Fresnel transform method depends on wavelength, a wavelength-dependent-zero-padding algorithm is described and results in a rigorous sizing of each reconstructed monochrome image. The criterion to optimize the parameters is presented and is based on minimizing the widening of the impulse response of the full recording/reconstruction process. The application of the proposed method is illustrated through the analysis of the mechanical deformation of the electronic component, and offers keys to understand its failure mode in industrial conditions.