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Thermoelastic behavior of a thermoelectric thin-film attached to an infinite elastic substrate |
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| Authors: | Y Liu C Zhang |
| Institution: | 1. Graduate School at Shenzhen, Harbin Institute of Technology, Harbin, P.R. China;2. School of Civil Engineering, Qingdao University of Technology, Qingdao, P.R. China;3. Centre for Infrastructure Engineering, School of Computing, Engineering and Mathematics, Western Sydney University, Penrith, Australia |
| Abstract: | AbstractThis paper examines the thermoelectric behaviour of a thermoelectric thin film bonded to an elastic substrate. A calculation model for thermoelectric thin films is developed based on the singular integral equation method. The interface shear stress is found to exhibit singular behaviour at the ends of the films. Numerical results for the thermal stress distribution in the film and the film/substrate interface are obtained. Effects of film thickness and the substrate to film stiffness ratio on the stress of the film and the stress intensity factor of the interface are identified. The effects of interface electricity conductivity and the elastic–plastic deformation of the film are discussed. |
| Keywords: | Thermoelectric film stress intensity factor fracture mechanics |